ProMOS announced in this afternoon’s investor conference (May 8th) that it will cooperate with Hynix to develop DRAM chips. Hynix will transfer its 50nm stack process technology to ProMOS, at the same time to purchase 8%-10% stake of the company. ProMOS emphasized that the relationship between the two companies will be strengthened as Hynix will become a shareholder of ProMOS.

According to strategic alignment contract signed by the two companies, Hynix will transfer its 50nm stack process technology to ProMOS and that ProMOS will provide its 12-inch wafer fab to manufacture DRAM products of this technology, supplying to Hynix. ProMOS indicated that Hynix is planed to bring forward requisition to Korea government in recent days, making sure that 50nm process technology will be transferred to ProMOS smoothly.

In addition to this, Hynix will take about 10% stake of ProMOS through private placement, strengthening their long time strategic alignment relationship.

President of ProMOS noted that ProMOS acquires Hynix’s 50nm process technology will help both two companies to hold an important position in global DRAM market steadily. The transference of technology and cooperation this time not only will strengthen their relationship, but also will create a win-win situation.