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Published Oct.15 2019,10:40 AM (GMT+8)
G.Skill expanded two of its main product lines: the Trident Z Neo kits and the Trident Z Royal memory kits. The highest capacity kit, as well as the highest speed kit (unfortunately, you won't get both)
Published Sep.12 2019,18:24 PM (GMT+8)
Over the past few months, overclockers have come tantalizing close to overclocking DDR4 RAM to 6GHz, but nobody's quite been able to get there. Well, until now.
Published Sep.10 2019,09:45 AM (GMT+8)
G.Skill rarely lets a lot of time pass in between launching new memory kits, but what is a company to do when it already offers high-speed and high-capacity RAM? Combine them into one, of course.
Published Aug.19 2019,10:46 AM (GMT+8)
Under the theme of “Conversation about limitless future of storage industry ”, BIWIN demonstrated its comprehensive storage solutions and advanced SiP-based packaging and testing services to the experts and global customers participating the Summit.
Published Jul.09 2019,17:25 PM (GMT+8)
G.Skill claims its newest DDR4 RAM series features "optimized specifications" for builds that pair a third-generation Ryzen processor with an X570 motherboard.
Published Jun.11 2019,15:06 PM (GMT+8)
G.Skill held an overclocking competition at its booth throughout Computex week and ended breaking 23 records. Professional overclocker Toppc reached DDR4-5886, a world record, using Trident Z Royal memory on an MSI MPG Z390I Gaming Edge AC motherboard and an Intel Core i9-9900K processor.
Published Jun.06 2019,10:00 AM (GMT+8)
G.SKILL International Enterprise Co., Ltd., the world’s leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the winner of the 6th Annual OC World Cup 2019
Published Mar.11 2019,01:59 AM (GMT+8)
G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce the 6th Annual OC World Cup 2019.
Published Feb.25 2019,12:05 PM (GMT+8)
BIWIN will show customers a full range of storage solutions for mobile smart devices at the 2019 Embedded World conference, including eMMC, eMCP
Published Feb.14 2019,05:30 AM (GMT+8)
On November 15, 2018, the 2nd Chongqing International Mobile Exhibition was ceremoniously held at the Chongqing (Nanping) International Convention & Exhibition Center, where the complete memory chip solution series of BIWIN were shown in the international exhibition - the complete embedded solution series were presented based on the subject of “BIWIN’s Memory - Oriented Solution&rd
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